Projects per year
Projects
- 3 Finished
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Finished
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(3/3)
Liu, C.-Y. (PI)
1/08/18 → 31/07/19
Project: Research
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Effect of LED Die-Attachment on Stress in GaN Eip-Layers and Anelastic Behavior(3/3)
Liu, C.-Y. (PI)
1/08/17 → 31/07/18
Project: Research
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Development of Cu Recycling for Micro Cu Powders Used in Electronics-Grade Cu Slurry( I )
Cheng, S.-L. (PI)
1/06/17 → 31/05/18
Project: Research