TY - GEN
T1 - Evolutionary engineering collaboration for DFM/DFY solutions between foundry and EDA tool vendor
AU - Su, Yea Huey
AU - Guo, Ruey Shan
AU - Chang, Hsiao Huan
PY - 2006
Y1 - 2006
N2 - With the migration to deep-submicron technology, foundries face even more challenges than ever to help their customers to develop IC for time-to-market. The goal of this research is then to explore how foundries and EDA tool vendors collaborate with each other for DFM/DFY solutions. By conducting field interviews and empirical study on two leading foundaries and three EDA tool vendors, this research summarizes four aspects of collaboration activities, which are design problem, design scope, released information, and collaboration mechanism, under three different collaboration stages. Results of the study show that in the era of DFM, both parties have expanded their collaboration activities, from post-design manufacturing stage to all stages of design. In addition, the collaboration pattern has transformed from input-output coordination to know-how sharing and then to know-how creation in 90nm technology. The study concludes that as design automation and process technology become more advanced, the value of reference flow becomes higher.
AB - With the migration to deep-submicron technology, foundries face even more challenges than ever to help their customers to develop IC for time-to-market. The goal of this research is then to explore how foundries and EDA tool vendors collaborate with each other for DFM/DFY solutions. By conducting field interviews and empirical study on two leading foundaries and three EDA tool vendors, this research summarizes four aspects of collaboration activities, which are design problem, design scope, released information, and collaboration mechanism, under three different collaboration stages. Results of the study show that in the era of DFM, both parties have expanded their collaboration activities, from post-design manufacturing stage to all stages of design. In addition, the collaboration pattern has transformed from input-output coordination to know-how sharing and then to know-how creation in 90nm technology. The study concludes that as design automation and process technology become more advanced, the value of reference flow becomes higher.
UR - http://www.scopus.com/inward/record.url?scp=50249181175&partnerID=8YFLogxK
U2 - 10.1109/ISSM.2006.4493140
DO - 10.1109/ISSM.2006.4493140
M3 - 會議論文篇章
AN - SCOPUS:50249181175
SN - 9784990413804
T3 - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
SP - 475
EP - 478
BT - ISSM 2006 Conference Proceedings - Fifteenth International Symposium on Semiconductor Manufacturing
T2 - ISSM 2006 - 15th International Symposium on Semiconductor Manufacturing
Y2 - 25 September 2007 through 27 September 2007
ER -