Evaluation of tensile static, dynamic, and cyclic fatigue behavior for a HIPed silicon nitride at elevated temperatures

Chih Kuang Jack Lin, Michael G. Jenkins, Mattison K. Ferber

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Tensile fatigue behavior of a hot-isostatically-pressed (HIPed) silicon nitride was investigated over ranges of constant stresses, constant stress rates, and cyclic loading at 1150-1370°C. At 1150°C, static and dynamic failures were governed by a slow crack growth mechanism. Creep rupture was the dominant failure mechanism in static fatigue at 1260 and 1370°C. A transition of failure mechanism from slow crack growth to creep rupture appeared at stress rates ≤10-2 MPa/s for dynamic fatigue at 1260 and 1370°C. At 1150-1370°C, cyclic loading appeared to be less damaging than static loading as cyclic fatigue specimens displayed greater failure times than static fatigue specimens under the same maximum stresses.

Original languageEnglish
Title of host publicationSilicon Nitride Ceramics, Scientific and Technological Advances
PublisherPubl by Materials Research Society
Pages455-460
Number of pages6
ISBN (Print)1558991824
StatePublished - 1993
EventMaterials Research Society Fall Meeting - Boston, MA, USA
Duration: 1 Dec 19923 Dec 1992

Publication series

NameMaterials Research Society Symposium Proceedings
Volume287
ISSN (Print)0272-9172

Conference

ConferenceMaterials Research Society Fall Meeting
CityBoston, MA, USA
Period1/12/923/12/92

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