Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials

Engineering & Materials Science

• Diffusion barriers 100%
• Lead-free solders 83%
• Intermetallics 71%
• Nickel-Phosphorus 42%
• Growth kinetics 19%
• Bismuth 18%
• Surface chemistry 17%
• Activation energy 14%
• Annealing 13%
• Mechanical properties 8%

Physics & Astronomy

• thermoelectric materials 76%
• solders 75%
• intermetallics 60%
• evaluation 42%
• phosphorus 26%
• nickel 21%
• bismuth tellurides 19%
• modules 11%
• plots 11%
• activation energy 9%
• mechanical properties 9%
• annealing 8%
• kinetics 8%

Chemical Compounds

• Diffusion Barrier 85%
• Intermetallic Compound 72%
• Thermoelectricity 15%
• Surface Chemistry 12%
• Phosphorus(.) 11%
• Annealing 10%
• Alloy 9%
• Reaction Activation Energy 9%