Erratum: In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation X-rays (Journal of Electronic Materials (2009) 38:11 (2308-2313) DOI: 10.1007/s11664-009-0934-9))

Albert T. Wu, Chun Yang Tsai, Chin Li Kao, Meng Kai Shih, Yi Shao Lai, Hsin Yi Lee, Ching Shun Ku

Research output: Contribution to journalComment/debate

Original languageEnglish
Pages (from-to)2786
Number of pages1
JournalJournal of Electronic Materials
Issue number12
StatePublished - Dec 2009

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