Skip to main navigation Skip to search Skip to main content

Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering