Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

Liang Yu Ou Yang; Chia Hung Kao

doi:10.1109/IMPACT56280.2022.9966694

Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

Liang Yu Ou Yang, Chia Hung Kao

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Recently, the millimeter-wave chip packaging has been a research topic of interest in the fifth generation of wireless communication [1]. The higher operating frequency causes that the parasitic effects of package structures are not negligible anymore and may deteriorate the chip performance. Shorting the electrical length of a package structure is the most straightforward approach to mitigating the packaging effect on chips. The flip-chip structure is widely used as a high-frequency interconnection because of its solder bumps, which can provide a shorter electrical signal path. Hence it is essential to develop the equivalent lumped circuit of the solder bumps. In addition, calibration must be carried out for eliminating the structure effects not induced by the bump interconnection.

Original language	English
Title of host publication	Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
Publisher	IEEE Computer Society
ISBN (Electronic)	9781665452212
DOIs	https://doi.org/10.1109/IMPACT56280.2022.9966694
State	Published - 2022
Event	17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022 - Taipei, Taiwan Duration: 26 Oct 2022 → 28 Oct 2022

Publication series

Name	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2022-October
ISSN (Print)	2150-5934
ISSN (Electronic)	2150-5942

Conference

Conference	17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
Country/Territory	Taiwan
City	Taipei
Period	26/10/22 → 28/10/22

Access to Document

10.1109/IMPACT56280.2022.9966694

類表面電漿之時-空間色散工程於高頻雷達系統之整合應用(1/2)
Ou Yang, L.-Y. (PI)
1/08/21 → 31/07/22
Project: Research

Cite this

Yang, L. Y. O., & Kao, C. H. (2022). Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications. In Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2022-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT56280.2022.9966694

Yang, Liang Yu Ou ; Kao, Chia Hung. / Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications. Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. IEEE Computer Society, 2022. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

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title = "Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications",

abstract = "Recently, the millimeter-wave chip packaging has been a research topic of interest in the fifth generation of wireless communication [1]. The higher operating frequency causes that the parasitic effects of package structures are not negligible anymore and may deteriorate the chip performance. Shorting the electrical length of a package structure is the most straightforward approach to mitigating the packaging effect on chips. The flip-chip structure is widely used as a high-frequency interconnection because of its solder bumps, which can provide a shorter electrical signal path. Hence it is essential to develop the equivalent lumped circuit of the solder bumps. In addition, calibration must be carried out for eliminating the structure effects not induced by the bump interconnection.",

author = "Yang, {Liang Yu Ou} and Kao, {Chia Hung}",

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Yang, LYO & Kao, CH 2022, Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications. in Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, vol. 2022-October, IEEE Computer Society, 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022, Taipei, Taiwan, 26/10/22. https://doi.org/10.1109/IMPACT56280.2022.9966694

Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications. / Yang, Liang Yu Ou; Kao, Chia Hung.
Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. IEEE Computer Society, 2022. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2022-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - Recently, the millimeter-wave chip packaging has been a research topic of interest in the fifth generation of wireless communication [1]. The higher operating frequency causes that the parasitic effects of package structures are not negligible anymore and may deteriorate the chip performance. Shorting the electrical length of a package structure is the most straightforward approach to mitigating the packaging effect on chips. The flip-chip structure is widely used as a high-frequency interconnection because of its solder bumps, which can provide a shorter electrical signal path. Hence it is essential to develop the equivalent lumped circuit of the solder bumps. In addition, calibration must be carried out for eliminating the structure effects not induced by the bump interconnection.

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Yang LYO, Kao CH. Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications. In Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. IEEE Computer Society. 2022. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT56280.2022.9966694

Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

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類表面電漿之時-空間色散工程於高頻雷達系統之整合應用(1/2)

Cite this