Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection

Naseem, Nan Wei Chen, Syed Hasan Parvez, Zohauddin Ahmad, Sean Yang, H. S. Chen, Hsiang Szu Chang, Jack Jia Sheng Huang, Jin Wei Shi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Flip-chip bonding APDs with 14μm window diameters are demonstrated. Wide-bandwidth (36GHz), high-responsivity (3.4A/W), low dark current (175nA) and high MMW output power (-1dBm at 40GHz) can be achieved simultaneously with 12.5mA Isat under 0.9Vbr.

Original languageEnglish
Title of host publication2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781957171180
DOIs
StatePublished - 2023
Event2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - San Diego, United States
Duration: 5 May 20239 May 2023

Publication series

Name2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - Proceedings

Conference

Conference2023 Optical Fiber Communications Conference and Exhibition, OFC 2023
Country/TerritoryUnited States
CitySan Diego
Period5/05/239/05/23

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