Electrorecrystallization of Metal Alloy

Ying Ta Chiu, Kwang Lung Lin, Albert T. Wu, Wei Luen Jang, Chung Li Dong, Yi Shao Lai

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Abstract

This work first reports the behavior of electrorecrystallization of metal alloy, solder in this study. The electrorecrystallization is the recrystallization of metal alloy induced by electrical current stressing without the need of prior treatment. The synchrotron radiation X-ray diffraction (XRD) in situ analysis shows that the crystal facets of the Pb matrix of 95Pb5Sn solder alloy gradually diminish during electrical current stressing. The XRD analysis incorporating with in situ synchrotron extended X-ray absorption for fine structure (EXAFS) reveals complete dissolution, giving rise to supersaturation, of the Sn-rich secondary phase upon current stressing. The supersaturation behavior was explained through the crystal relaxation of the Pb matrix induced by current stressing. The recrystallization gives rise to Sn nanorod. High resolution TEM analysis of the nanorod reveals the semi-coherent/incoherent interfaces and provides explanation for the formation of the Sn nanorod.

Original languageEnglish
Pages (from-to)190-194
Number of pages5
JournalJournal of Alloys and Compounds
Volume549
DOIs
StatePublished - 5 Feb 2013

Keywords

  • Electromigration
  • Recrystallization
  • Solder
  • Supersaturation

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