Electromigration studies on Sn(Cu) alloy lines

C. C. Lu, S. J. Wang, C. Y. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Cu alloying effect in Sn(Cu) solder line has been studied. We found that the Sn0.7Cu solder line has the most serious EM damage than pure Sn and Sn3.0Cu solder lines. The dominant factor for the fast EM rate in Sn0.7Cu could be attributed to the relatively small grain size and the low critical stress, i.e., the yielding stress of Sn0.7Cu solder line. Also, we found that the shortest Sn0.7Cu solder line, 250 μm, has most serious EM damage among three solder lines of different lengths. The back-stress induced by EM might not play a significant role on the EM test of long solder lines. A new failure mode of EM test, i.e., EM under an external tensile, was observed. The external stress would be superimposed on the stress profile induced by EM. As a result, the hillock formation at the anode side was retarded and void formation at the cathode was enhanced.

Original languageEnglish
Title of host publicationProceedings - 2005 10th International Symposium on Advanced Packaging Materials
Subtitle of host publicationProcesses, Properties and Interfaces
Pages54-59
Number of pages6
DOIs
StatePublished - 2005
Event2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States
Duration: 16 Mar 200518 Mar 2005

Publication series

NameProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Volume2005

Conference

Conference2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Country/TerritoryUnited States
CityIrvine, CA
Period16/03/0518/03/05

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