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Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces
- H. W. Tseng
- , C. T. Lu
- , Y. H. Hsiao
- , P. L. Liao
- , Y. C. Chuang
- , T. Y. Chung
- , C. Y. Liu
Research output: Contribution to journal › Article › peer-review
34
Scopus
citations