@inproceedings{2a6db1ef6f804f5092243b2b4ac56e8f,
title = "Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces",
abstract = "We observed various EM-induced failures in current-stressed Cu/Sn/Cu flip-chip solder joints. EM-induced Cu-pad consumption occurred at the current-entry point (maximum current-density) on the cathode interface, and voiding occurred at the other joint corner away from the current-entry point (minimum current-density). We believe that the above various EM-induced failure modes were the result of different current-stressing densities and joule heating at the cathode joint interfaces.",
keywords = "Electromigration, Packaging",
author = "Tseng, {H. W.} and Lu, {C. T.} and Hsiao, {Y. H.} and Liao, {P. L.} and Chuang, {Y. C.} and Liu, {C. Y.}",
note = "Funding Information: The authors would like to acknowledge the financial support of the National Science Council (NSC) and Advanced Semiconductor Engineering Inc. (ASE), Taiwan.; 2009 11th Electronic Packaging Technology Conference, EPTC 2009 ; Conference date: 09-12-2009 Through 11-12-2009",
year = "2009",
doi = "10.1109/EPTC.2009.5416515",
language = "???core.languages.en_GB???",
isbn = "9781424451005",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
pages = "401--405",
booktitle = "EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference",
}