Effects of Cu content on electrochemical response in Ti-based metallic glasses under simulated body fluid

C. H. Huang, J. J. Lai, J. C. Huang, C. H. Lin, J. S.C. Jang

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

Systematic characterization of the corrosion response of the Cu-free Ti45Zr40Si15 and Cu-containing Ti40Zr40Si15-Cu5 and Ti45Zr20-Cu35 metallic glasses (MGs) in the Hank's solution is conducted, in terms of the open circuit potential, potentiodynamic polarization, as well as electrochemical impedance measurements. The Cu role in the Ti-based MGs, tentatively to be applied for bio-implants, is established and modeled. The presence of nobler Cu will impose two opposite effects. The minor positive effect of minor shift of Ecorr is not a major issue, but the negative effect on local pitting and ion release would cause a major drawback. The ICP-MS indicates that the release of Cu ions increases with increasing Cu content. For more promising anti-pitting ability, the Cu content in Ti-based MGs should be kept as low as possible, better to be none or less than about 5 at.%.

Original languageEnglish
Pages (from-to)368-376
Number of pages9
JournalMaterials Science and Engineering C
Volume62
DOIs
StatePublished - 1 May 2016

Keywords

  • Corrosion
  • Metallic glass
  • Pitting
  • Ti alloy

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