Effects of continuously applied stress on tin whisker growth

Chih Kuang Lin, Tung Hsien Lin

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

A simple four-point bending technique in conjunction with scanning electron microscopy (SEM) was employed to investigate the relationship between continuously applied mechanical stress and tin whisker growth on bright tin-plated copper specimens at room temperature. Measurements of whisker length and density were periodically taken for each specimen during a 7-month exposure to applied stress. Tin whiskers were found on the tin-plated specimens with or without the presence of mechanically applied stresses. A continuously applied compressive stress resulted in formation of longer and more dense tin whiskers, in comparison with the cases of no applied stress and applied tensile stress. However, an increase in the applied compressive stress level caused an increase in the whisker density but a decrease in the whisker length. On the other hand, a continuously applied tensile stress was found to reduce both the whisker density and length, compared to the case of no applied stress. Apparently, application of a continuous tensile stress could provide an effective means in retarding tin whisker growth.

Original languageEnglish
Pages (from-to)1737-1740
Number of pages4
JournalMicroelectronics Reliability
Volume48
Issue number10
DOIs
StatePublished - Oct 2008

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