Silicon reinforced copper matrix composites exhibit high thermal conductivity and low coefficient of thermal expansion (CTE) by combining the high thermal conductivity of copper and the low CTE of silicon. To this end, a study was conducted on a copper matrix composite containing a high Si particle volume fraction in the range from 50% to 80% using a powder metallurgy method. The study focused on the effects of 5-10 vol% aluminum powder added to the matrix. The feasibility of the Cu/Sip composites for electronic packaging materials is based on a study determining the mechanical strength, the thermal conductivity and the CTE of the CuSip composites.
|Number of pages||6|
|State||Published - 30 Aug 1999|