Effective charge number of Cu in Cu-Sn compound

C. T. Lu, Y. J. Hu, Y. S. Liu, T. S. Huang, H. W. Tseng, C. Y. Chen, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


As current-stressing a Cu/Sn joint interface, the Cu atoms in the interfacial cathode Cu-Sn compound would experience the direct electromigration force and chemical potential force simultaneously, which have never been decoupled. In this work, a triple-junction Cu-Sn-Cu joint was designed and current-stressed to separate the above electromigration and chemical forces imposed on the Cu atoms in the Cu-Sn compound. In addition, by obtaining the individual value of the electromigration Cu flux in the cathode Cu 6Sn5 compound layer, the effective charge number (Z*) of Cu atoms in the Cu6Sn5 compound can be determined to be 35.6.

Original languageEnglish
Pages (from-to)P73-P75
JournalECS Solid State Letters
Issue number5
StatePublished - 2012


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