Effect of voltage supply mode on electrolytic machining of polycrystalline silicon

Po Huai Yu, Kun Ling Wu, Shin Min Lee, Biing Hwa Yan

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Wire electric discharge machining (WEDM) of polycrystalline silicon (polysilicon) involves high-temperature melting that easily produces cracks on the wafer surface. This study explored the removal of surface defects by electrolytic machining (EM) to enhance surface quality. EM of polysilicon was conducted under different voltage supply modes, namely, DC voltage (DC-V), pulse voltage (Pulse-V), and auxiliary pulse voltage (Auxiliary-P-V) to examine their effects on material removal (MR) and surface roughness (SR). Results show that poor surface quality was achieved by EM with DC-V mode due to accumulation of bubbles between electrode gaps and inefficient MR. In contrast, EM with Pulse-v supply can reduce SR by proper control of pulse voltage cycle through adjustment in pulse-on and pulse-off time to ensure good replenishment of electrolyte. Finally, adding an optimal auxiliary voltage to the pulse cycle contributes to EM stability. Hence, EM with Auxiliary-P-V supply is an effective approach to electrolytic machining of WEDMed polysilicon. Not only is high MR achieved, but good surface quality is also maintained.

Original languageEnglish
Pages (from-to)1459-1465
Number of pages7
JournalMaterials and Manufacturing Processes
Volume26
Issue number12
DOIs
StatePublished - 2011

Keywords

  • Crack
  • Electrolytic machining (EM)
  • Polysilicon
  • Wire electrical discharge machining (WEDM)

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