Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

Hao Chen; Yi Ling Tsai; Yu Ting Chang; Albert T. Wu

doi:10.1016/j.jallcom.2016.02.027

Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

Hao Chen, Yi Ling Tsai, Yu Ting Chang, Albert T. Wu

Department of Chemical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

37 Scopus citations

Abstract

This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on the microstructural evolution and mechanical properties of solder joints after multiple reflows. SAC305 solder was reflowed on substrates with four Co-based surface finishes: electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). CoSn₃ was the main intermetallic compound (IMC) that formed in the systems, and it massively spalled in the systems with Pd and high P content. Systems with massive spalling have a high shear strength and low shear height owing to solid solution strengthening. Due to strain hardening, high shear velocity caused high strength in all systems. Massive spalling of CoSn₃ transformed the failure mode from brittle to ductile and enhanced the shear strength of the joints.

Original language	English
Pages (from-to)	100-108
Number of pages	9
Journal	Journal of Alloys and Compounds
Volume	671
DOIs	https://doi.org/10.1016/j.jallcom.2016.02.027
State	Published - 25 Jun 2016

Keywords

Co-Sn-P
Intermetallic compound
Massive spalling
Multiple reflows
SAC305
Shear test

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title = "Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes",

abstract = "This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on the microstructural evolution and mechanical properties of solder joints after multiple reflows. SAC305 solder was reflowed on substrates with four Co-based surface finishes: electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). CoSn3 was the main intermetallic compound (IMC) that formed in the systems, and it massively spalled in the systems with Pd and high P content. Systems with massive spalling have a high shear strength and low shear height owing to solid solution strengthening. Due to strain hardening, high shear velocity caused high strength in all systems. Massive spalling of CoSn3 transformed the failure mode from brittle to ductile and enhanced the shear strength of the joints.",

keywords = "Co-Sn-P, Intermetallic compound, Massive spalling, Multiple reflows, SAC305, Shear test",

author = "Hao Chen and Tsai, {Yi Ling} and Chang, {Yu Ting} and Wu, {Albert T.}",

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T1 - Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

AU - Chen, Hao

AU - Tsai, Yi Ling

AU - Chang, Yu Ting

AU - Wu, Albert T.

PY - 2016/6/25

Y1 - 2016/6/25

N2 - This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on the microstructural evolution and mechanical properties of solder joints after multiple reflows. SAC305 solder was reflowed on substrates with four Co-based surface finishes: electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). CoSn3 was the main intermetallic compound (IMC) that formed in the systems, and it massively spalled in the systems with Pd and high P content. Systems with massive spalling have a high shear strength and low shear height owing to solid solution strengthening. Due to strain hardening, high shear velocity caused high strength in all systems. Massive spalling of CoSn3 transformed the failure mode from brittle to ductile and enhanced the shear strength of the joints.

AB - This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on the microstructural evolution and mechanical properties of solder joints after multiple reflows. SAC305 solder was reflowed on substrates with four Co-based surface finishes: electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). CoSn3 was the main intermetallic compound (IMC) that formed in the systems, and it massively spalled in the systems with Pd and high P content. Systems with massive spalling have a high shear strength and low shear height owing to solid solution strengthening. Due to strain hardening, high shear velocity caused high strength in all systems. Massive spalling of CoSn3 transformed the failure mode from brittle to ductile and enhanced the shear strength of the joints.

KW - Co-Sn-P

KW - Intermetallic compound

KW - Massive spalling

KW - Multiple reflows

KW - SAC305

KW - Shear test

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U2 - 10.1016/j.jallcom.2016.02.027

DO - 10.1016/j.jallcom.2016.02.027

M3 - 期刊論文

AN - SCOPUS:84958962403

SN - 0925-8388

VL - 671

SP - 100

EP - 108

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

ER -

Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

Abstract

Keywords

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