Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition

Y. K. Tang, E. J. Lin, J. Y. Wang, Y. X. Lin, C. Y. Wu, C. Y. Chiu, C. H. Lee, C. P. Wang, C. Y. Liu

Department of Chemical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

4 results

Finished
Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(3/3)
Liu, C.
1/08/20 → 31/07/21
Project: Research
High Efficiency and High Freedom Packaging Technique of Tandem Perovskite Solar Cell(2/3)
Liu, C.
1/08/20 → 31/07/21
Project: Research
Development of Cu Recycling for Micro Cu Powders Used in Electronics-Grade Cu Slurry( III )
Cheng, S.
1/06/19 → 31/05/20
Project: Research
Integration and Development of Flexible II i-V Solar Cells and Self-Sustaining Smart Dust Chips( I )
Shi, J.
1/04/19 → 31/12/19
Project: Research