Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)

C. Y. Wu, Y. H. Chen, Y. K. Tang, E. J. Lin, Y. X. Lin, J. Y. Wang, W. X. Zhuang, C. H. Lee, C. Y. Chiu, C. Y. Yeh, C. Y. Hsiao, M. L. Cheng, A. L. Liu, C. Y. Liu

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

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Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(2/3)
Liu, C.-Y. (PI)
1/08/19 → 31/07/20
Project: Research
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(3/3)
Liu, C.-Y. (PI)
1/08/18 → 31/07/19
Project: Research