Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

Y. X. Lin, J. Y. Wang, C. Y. Chen, C. Y. Wu, C. Y. Chiu, C. H. Lee, C. Y. Yeh, B. R. Huang, J. S. Chang, T. H. Yen, K. L. Fu, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration'. Together they form a unique fingerprint.

Keyphrases

Material Science