Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

C. Y. Liu; Chih Chen; A. K. Mal; K. N. Tu

doi:10.1063/1.369779

Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

C. Y. Liu, Chih Chen, A. K. Mal, K. N. Tu

Department of Chemical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

81 Scopus citations

Abstract

The interfaces of under bump metallization (UBM)/solder joints was studied to assess the mechanical reliability of flip chip solder joints. Weak compound/Cr and solder/Cr interfaces had led to brittle fracture and the fracture strength decreased rapidly with annealing time. The crack formation at the corners and edges affected the tensile and shear strengths of the solder joint.

Original language	English
Pages (from-to)	3882-3886
Number of pages	5
Journal	Journal of Applied Physics
Volume	85
Issue number	7
DOIs	https://doi.org/10.1063/1.369779
State	Published - 1 Apr 1999

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title = "Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints",

abstract = "The interfaces of under bump metallization (UBM)/solder joints was studied to assess the mechanical reliability of flip chip solder joints. Weak compound/Cr and solder/Cr interfaces had led to brittle fracture and the fracture strength decreased rapidly with annealing time. The crack formation at the corners and edges affected the tensile and shear strengths of the solder joint.",

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AU - Tu, K. N.

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N2 - The interfaces of under bump metallization (UBM)/solder joints was studied to assess the mechanical reliability of flip chip solder joints. Weak compound/Cr and solder/Cr interfaces had led to brittle fracture and the fracture strength decreased rapidly with annealing time. The crack formation at the corners and edges affected the tensile and shear strengths of the solder joint.

AB - The interfaces of under bump metallization (UBM)/solder joints was studied to assess the mechanical reliability of flip chip solder joints. Weak compound/Cr and solder/Cr interfaces had led to brittle fracture and the fracture strength decreased rapidly with annealing time. The crack formation at the corners and edges affected the tensile and shear strengths of the solder joint.

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JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

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Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

Abstract

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