Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

C. Y. Liu, Chih Chen, A. K. Mal, K. N. Tu

Research output: Contribution to journalArticlepeer-review

81 Scopus citations

Abstract

The interfaces of under bump metallization (UBM)/solder joints was studied to assess the mechanical reliability of flip chip solder joints. Weak compound/Cr and solder/Cr interfaces had led to brittle fracture and the fracture strength decreased rapidly with annealing time. The crack formation at the corners and edges affected the tensile and shear strengths of the solder joint.

Original languageEnglish
Pages (from-to)3882-3886
Number of pages5
JournalJournal of Applied Physics
Volume85
Issue number7
DOIs
StatePublished - 1 Apr 1999

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