Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems

Y. K. Tang, E. J. Lin, J. Y. Wang, Y. S. Lin, Y. J. Hu, Y. C. Hsu, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Fingerprint

Dive into the research topics of 'Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds