Diamond heat spreader layer for high-power thin-GaN light-emitting diodes

Po Han Chen, Ching Liang Lin, Y. K. Liu, Te Yuan Chung, Cheng Yi Liu

Research output: Contribution to journalArticlepeer-review

39 Scopus citations


A diamond-coating layer is studied as a heat spreading layer for a thin-GaN light-emitting diode (LED) chip. Our results show that this diamond layer can effectively spread the heat and improve the temperature uniformity of a thin-GaN LED chip, which enhances the heat dissipation efficiency down to the heat sink.With the diamond heat spreading layer, the junction temperature of the thin-GaN LED was reduced by 20 °C at 1-A current input and the uniformity of the temperature distribution is also greatly improved.

Original languageEnglish
Pages (from-to)845-847
Number of pages3
JournalIEEE Photonics Technology Letters
Issue number10
StatePublished - 15 May 2008


  • Diamond
  • Heat spreading layer
  • Light-emitting diodes (LEDs)
  • Thin-GaN light-emitting diode (LED)


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