Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon

S. L. Tsai, H. Z. Ke, J. H. Ke, F. Y. Huang, B. H. Yan

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

This study has developed a new polishing pad and an accompanying group of parameters for polishing monocrystalline silicon. A hot melt adhesive polishing pad coated with SiC abrasive uses these parameters more effectively and provides better polishing quality when compared with a conventional wool pad. Three control parameters, feed rate, polishing load and turning speed of the polishing wheel, were tested to identify their impact on the polishing quality of the silicon surface. A silicon surface polished with the proposed new pad under optimum conditions can obtain surface roughness of 2.45 nm Ra with mirror-like appearance.

Original languageEnglish
Pages (from-to)92-102
Number of pages11
JournalProceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
Volume226
Issue number1
DOIs
StatePublished - Jan 2012

Keywords

  • Hot melt adhesive
  • Monocrystalline silicon
  • Polishing pad
  • Surface roughness

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