Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

C. Y. Yeh, J. Y. Wang, C. Y. Wu, C. Y. Chiu, C. H. Lee, B. R. Huang, K. L. Fu, J. S. Chang, T. H. Yen, Y. F. Lee, C. Y. Liu

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Engineering

Material Science