Design, fabrication, and reliability testing of embedded optical interconnects on package

Shashikant Hegde, Raghuram V. Pucha, Daniel Guidotti, Fuhan Liu, Yin Jung Chang, Rao Tummala, Gee Kung Chang, Suresh K. Sitaraman

Research output: Contribution to journalConference articlepeer-review

9 Scopus citations


Optical interconnections offer a potential solution to some of the bottlenecks that electrical interconnection systems face. Some of the challenges with optical interconnect design and development are the introduction of new optoelectronic materials and processes, the increasing bandwidth and decreasing loss requirements, and the need for reducing cost without compromising reliability. The goal of this paper is to report our ongoing work on optical interconnects and interfaces for very short-haul backplane, and board/package-level chip-to-chip interconnections. This research will fit in with our future proposed integration technology of embedded optoelectronic active devices such as detector arrays, optical amplifiers and laser arrays coupled to the waveguide by alignment tolerant beam turning passive elements. Through testbed design, fabrication, and reliability testing, the waveguide polymer materials and integration process will be evaluated based on a number of factors which include: optical loss, roughness, optical aging, spectral absorption, refractive index and thermal stability.

Original languageEnglish
Pages (from-to)895-900
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2004
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: 1 Jun 20044 Jun 2004


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