Design and fabrication of passive components using TF-IPD technology

Tsaitzu Lee, Yo Shen Lin, Chiajiun Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

In this paper, we develop a low-cost manufacturing technology for RF system-in-package applications. This high-performance process technology for integrated passive devices is achieved by electroplated formed thick Cu metal trace and back-side substrate thinning process on 8-inch glass wafer. This paper first presents investigations for common integration of inductors, resistors, capacitors in this thin film process technology and examines their RF performance. Then, a lowpass filter design for 2.4 GHz ISM band application is also demonstrated. Good RF performance as well as small form factor are achieved.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages722-725
Number of pages4
DOIs
StatePublished - 2009
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 21 Oct 200923 Oct 2009

Publication series

NameIMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

ConferenceIMPACT Conference 2009 International 3D IC Conference
Country/TerritoryTaiwan
CityTaipei
Period21/10/0923/10/09

Keywords

  • EM simulation
  • Filter
  • Glass substrate
  • Thin-film integrated passive device (TF-IPD)

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