Deep-learning-based Extraction of Electronic Component Parameters from Datasheets

Tzung Pei Hong, Hsiu Wei Chiu, Shih Feng Huang, Yi Ting Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

In this paper, we propose an automatic extraction process of the dimension parameters shown in three-view drawings. It is divided into two stages. In the first stage, we detect three-view drawings in datasheets and find out the text regions containing the parameters in the drawings by deep learning. We then recognize the values in these regions. In the second stage, we design two algorithms, based on k-nearest neighbors (k-NN) and statistical evaluation, respectively, to match the digitized parameters with the values. We also conduct experiments to show the high accuracy in the two stages.

Original languageEnglish
Title of host publicationProceedings - 2021 IEEE International Conference on Big Data, Big Data 2021
EditorsYixin Chen, Heiko Ludwig, Yicheng Tu, Usama Fayyad, Xingquan Zhu, Xiaohua Tony Hu, Suren Byna, Xiong Liu, Jianping Zhang, Shirui Pan, Vagelis Papalexakis, Jianwu Wang, Alfredo Cuzzocrea, Carlos Ordonez
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages5501-5506
Number of pages6
ISBN (Electronic)9781665439022
DOIs
StatePublished - 2021
Event2021 IEEE International Conference on Big Data, Big Data 2021 - Virtual, Online, United States
Duration: 15 Dec 202118 Dec 2021

Publication series

NameProceedings - 2021 IEEE International Conference on Big Data, Big Data 2021

Conference

Conference2021 IEEE International Conference on Big Data, Big Data 2021
Country/TerritoryUnited States
CityVirtual, Online
Period15/12/2118/12/21

Keywords

  • deep learning
  • electronic design automation
  • object detection
  • text extraction
  • three-view drawing

Fingerprint

Dive into the research topics of 'Deep-learning-based Extraction of Electronic Component Parameters from Datasheets'. Together they form a unique fingerprint.

Cite this