@inproceedings{2f5c61fde1a046c3963194e9da057b1c,
title = "Current density dependence of EM (electromigration)-induced flip-chip Cu pad consumption",
author = "Liao, {P. L.} and Liu, {C. Y.}",
year = "2006",
doi = "10.1109/EMAP.2006.4430690",
language = "???core.languages.en_GB???",
isbn = "1424408342",
series = "2006 International Conference on Electronic Materials and Packaging, EMAP",
booktitle = "2006 International Conference on Electronic Materials and Packaging, EMAP",
note = "2006 International Conference on Electronic Materials and Packaging, EMAP ; Conference date: 11-12-2006 Through 14-12-2006",
}