Current density dependence of EM (electromigration)-induced flip-chip Cu pad consumption

P. L. Liao, C. Y. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publication2006 International Conference on Electronic Materials and Packaging, EMAP
DOIs
StatePublished - 2006
Event2006 International Conference on Electronic Materials and Packaging, EMAP - Kowloon, China
Duration: 11 Dec 200614 Dec 2006

Publication series

Name2006 International Conference on Electronic Materials and Packaging, EMAP

Conference

Conference2006 International Conference on Electronic Materials and Packaging, EMAP
Country/TerritoryChina
CityKowloon
Period11/12/0614/12/06

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