Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step

B. R. Huang; C. Y. Yeh; Y. H. Hsu; C. P. Tsai; Y. F. Lee; J. Y. Wang; C. Y. Liu

doi:10.1007/s11837-022-05168-5

Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step

B. R. Huang, C. Y. Yeh, Y. H. Hsu, C. P. Tsai, Y. F. Lee, J. Y. Wang, C. Y. Liu

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The current work studied the effect of mixed glass frit on the colloid state in the Cu sintering process, which defines the Cu granular network structure for the Cu grain growth stage in the isothermal sintering step. The softening points of the B₂O₃-Bi₂O₃ and SiO₂-ZnO-B₂O₃ glass frits were 450°C and 650°C, respectively, which resulted in a two-step liquid sintering process. In the colloid state of the two-step liquid sintering process, the proper interfacial energy between the molten B₂O₃-Bi₂O₃ glass, Cu particles, and SiO₂-ZnO-B₂O₃ solid phase was developed to disperse all phases in the sintering Cu paste. The Cu grain size distribution was very uniform and formed a continuous Cu granular network structure, which was suitable for the subsequent Cu grain growth in the isothermal sintering process.

Original language	English
Journal	JOM
DOIs	https://doi.org/10.1007/s11837-022-05168-5
State	Accepted/In press - 2022

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title = "Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step",

abstract = "The current work studied the effect of mixed glass frit on the colloid state in the Cu sintering process, which defines the Cu granular network structure for the Cu grain growth stage in the isothermal sintering step. The softening points of the B2O3-Bi2O3 and SiO2-ZnO-B2O3 glass frits were 450°C and 650°C, respectively, which resulted in a two-step liquid sintering process. In the colloid state of the two-step liquid sintering process, the proper interfacial energy between the molten B2O3-Bi2O3 glass, Cu particles, and SiO2-ZnO-B2O3 solid phase was developed to disperse all phases in the sintering Cu paste. The Cu grain size distribution was very uniform and formed a continuous Cu granular network structure, which was suitable for the subsequent Cu grain growth in the isothermal sintering process.",

author = "Huang, {B. R.} and Yeh, {C. Y.} and Hsu, {Y. H.} and Tsai, {C. P.} and Lee, {Y. F.} and Wang, {J. Y.} and Liu, {C. Y.}",

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T1 - Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step

AU - Huang, B. R.

AU - Yeh, C. Y.

AU - Hsu, Y. H.

AU - Tsai, C. P.

AU - Lee, Y. F.

AU - Wang, J. Y.

AU - Liu, C. Y.

PY - 2022

Y1 - 2022

N2 - The current work studied the effect of mixed glass frit on the colloid state in the Cu sintering process, which defines the Cu granular network structure for the Cu grain growth stage in the isothermal sintering step. The softening points of the B2O3-Bi2O3 and SiO2-ZnO-B2O3 glass frits were 450°C and 650°C, respectively, which resulted in a two-step liquid sintering process. In the colloid state of the two-step liquid sintering process, the proper interfacial energy between the molten B2O3-Bi2O3 glass, Cu particles, and SiO2-ZnO-B2O3 solid phase was developed to disperse all phases in the sintering Cu paste. The Cu grain size distribution was very uniform and formed a continuous Cu granular network structure, which was suitable for the subsequent Cu grain growth in the isothermal sintering process.

AB - The current work studied the effect of mixed glass frit on the colloid state in the Cu sintering process, which defines the Cu granular network structure for the Cu grain growth stage in the isothermal sintering step. The softening points of the B2O3-Bi2O3 and SiO2-ZnO-B2O3 glass frits were 450°C and 650°C, respectively, which resulted in a two-step liquid sintering process. In the colloid state of the two-step liquid sintering process, the proper interfacial energy between the molten B2O3-Bi2O3 glass, Cu particles, and SiO2-ZnO-B2O3 solid phase was developed to disperse all phases in the sintering Cu paste. The Cu grain size distribution was very uniform and formed a continuous Cu granular network structure, which was suitable for the subsequent Cu grain growth in the isothermal sintering process.

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SN - 1047-4838

JO - JOM

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ER -

Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step

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