Cross-interaction effect in the Ni/Sn/Cu solder joints

H. W. Tseng, S. J. Wang, C. Y. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The mutual interaction between Sn/Ni and Sn/Cu interfacial reactions in a Ni/Sn/Cu sandwich solder joint structure has been discussed in this present work. The major interfacial reaction product on the Sn/Cu interface was Cu 6Sn5 phase, while on the Sn/Ni interface, a ternary (Cu,Ni)6Sn5 compound layer was formed, instead of the typical Ni-Sn compound phase. On the other hand, an asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tensile tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages325-330
Number of pages6
DOIs
StatePublished - 2009
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: 9 Dec 200911 Dec 2009

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2009 11th Electronic Packaging Technology Conference, EPTC 2009
Country/TerritorySingapore
CitySingapore
Period9/12/0911/12/09

Keywords

  • Cross-interaction
  • Packaging
  • UBM

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