@inproceedings{103d0332d07e4977ab02ed7e54c686c5,
title = "Cross-interaction effect in the Ni/Sn/Cu solder joints",
abstract = "The mutual interaction between Sn/Ni and Sn/Cu interfacial reactions in a Ni/Sn/Cu sandwich solder joint structure has been discussed in this present work. The major interfacial reaction product on the Sn/Cu interface was Cu 6Sn5 phase, while on the Sn/Ni interface, a ternary (Cu,Ni)6Sn5 compound layer was formed, instead of the typical Ni-Sn compound phase. On the other hand, an asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tensile tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.",
keywords = "Cross-interaction, Packaging, UBM",
author = "Tseng, {H. W.} and Wang, {S. J.} and Liu, {C. Y.}",
year = "2009",
doi = "10.1109/EPTC.2009.5416529",
language = "???core.languages.en_GB???",
isbn = "9781424451005",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
pages = "325--330",
booktitle = "EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference",
note = "2009 11th Electronic Packaging Technology Conference, EPTC 2009 ; Conference date: 09-12-2009 Through 11-12-2009",
}