Cross-interaction between au/sn and cu/sn interfacial reactions

Yee Wen Yen, H. W. Tseng, K. Zeng, S. J. Wang, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

The cross-interaction between Sn/Cu and Sn/Au interfacial reactions in an Au/Sn/Cu sandwich structure was studied. Field-emission electron probe microanalysis (FE-EPMA) revealed that the Cu content in the three Au-Sn phases (AuSn, AuSn 2, and AuSn 4) was very low, less than 1 at.%. This means that Cu from the opposite Cu foil did not participate in the interfacial reaction at the Sn/Au interface. On the opposite Sn/Cu side, Au-substituted (Cu,Au) 6Sn 5 formed within the initial 1 min of reflow. With prolonged reflow, the Au content in the Au-substituted (Cu,Au) 6Sn 5 increased and it transformed into a Cu-substituted (Au,Cu)Sn phase with 25 at.% Cu after 1 min of reflow at 250°C. The x-ray diffraction (XRD) pattern confirmed the phase transformation of Au-substituted (Cu,Au) 6Sn 5 to Cu-substituted (Au,Cu)Sn phase. In addition, there was greater Au consumption in the Au/Sn/Cu sandwich joint structure than in the single Au/Sn reaction case, due to some of the Au participating in the opposite Sn/Cu interfacial reaction.

Original languageEnglish
Pages (from-to)2257-2263
Number of pages7
JournalJournal of Electronic Materials
Volume38
Issue number11
DOIs
StatePublished - Nov 2009

Keywords

  • AuSn
  • Cross-interaction
  • Flip-chip technology

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