Fingerprint
Dive into the research topics of 'Correlation between resilient modulus and plastic deformation for cohesive subgrade soil under repeated loading'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Correlation between resilient modulus and plastic deformation for cohesive subgrade soil under repeated loading
Shu Rong Yang, Wei Hsing Huang, Chi Chou Liao
Research output: Contribution to journal › Article › peer-review
32
Scopus
citations