Considerations of characterizing standard SMT packages for RFIC applications

J. D.S. Deng, H. K. Chiou

Research output: Contribution to conferencePaperpeer-review

Abstract

Discussions for modeling RF characterization of commercial SMT package are made in this paper. This modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques of package leads for initial electrical parameters of a package. Then a direct leads measurement was performed to model the package for wireless communication applications. Relationship between package ground inductance and number of grounded leads is presented. Package back to back measurement was made to verify package parameters.

Original languageEnglish
Pages97-100
Number of pages4
StatePublished - 1998
EventProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA
Duration: 26 Oct 199828 Oct 1998

Conference

ConferenceProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
CityWest Point, NY, USA
Period26/10/9828/10/98

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