Discussions for modeling RF characterization of commercial SMT package are made in this paper. This modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques of package leads for initial electrical parameters of a package. Then a direct leads measurement was performed to model the package for wireless communication applications. Relationship between package ground inductance and number of grounded leads is presented. Package back to back measurement was made to verify package parameters.
|Number of pages||4|
|State||Published - 1998|
|Event||Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA|
Duration: 26 Oct 1998 → 28 Oct 1998
|Conference||Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging|
|City||West Point, NY, USA|
|Period||26/10/98 → 28/10/98|