Communication—eliminating thickness measurement uncertainty of capacitive displacement sensor in high resistivity substrate by photoconduction

Benjamin T.H. Lee, M. C. Lin

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

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Finished
Study for Symmetrical Bonded Structure Canceling Thermal Stresses to Realize Wafer Bonding and Layer Transfer of Dissimilar Materials (Continuing for the Second Year Study)
Lee, T.-H. (PI)
1/08/16 → 31/07/17
Project: Research