Keyphrases
Chip-level
100%
Co-sputtering
100%
Recurrent Urinary Tract Infections (rUTIs)
100%
Cu Diffusion
100%
Alloy Films
100%
Annealing
66%
Copper(II) Oxide
66%
Phase Separation
66%
Ti Film
66%
Grazing Angle
66%
Order of Magnitude
33%
Rutile
33%
Diffusivity
33%
X-ray Photoelectron Spectroscopy
33%
X Ray Diffraction
33%
Transmission Electron Microscopy
33%
Silica
33%
X-ray Transmission
33%
Long-term Annealing
33%
X-ray Diffraction Pattern
33%
Diffusion Behavior
33%
SiO2 Substrate
33%
Cu Atoms
33%
Thermocompression
33%
Cu Layer
33%
Oxide-free
33%
Cu-Cu Bonding
33%
Void-free
33%
Gibbs Energy of Formation
33%
Free Interface
33%
Diffusion Phase
33%
Engineering
Phase Separation
100%
Grazing Angle
100%
Silicon Dioxide
100%
Ray Diffraction
50%
Diffusivity
50%
Ray Photoelectron Spectroscopy
50%
Diffusion Behavior
50%
X-Ray Diffraction Pattern
50%
Gibbs Free Energy of Formation
50%
Material Science
Film
100%
Annealing
66%
X-Ray Diffraction
66%
Oxide Compound
33%
Diffusivity
33%
X-Ray Photoelectron Spectroscopy
33%
Titanium Dioxide
33%
Transmission Electron Microscopy
33%
Diffraction Pattern
33%
Surface (Surface Science)
33%
Chemical Engineering
Film
100%
Phase Separation
66%
Titanium Dioxide
33%
Diffusion
33%
Gibbs Free Energy
33%