Chip-to-chip optoelectronics SOP on organic boards or packages

Gee Kung Chang, Daniel Guidotti, Fuhan Liu, Yin Jung Chang, Zhaoran Huang, Venkatesh Sundaram, Devarajan Balaraman, Shashikant Hegde, Rao R. Tummala

Research output: Contribution to journalArticlepeer-review

31 Scopus citations


In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.

Original languageEnglish
Pages (from-to)386-397
Number of pages12
JournalIEEE Transactions on Advanced Packaging
Issue number2
StatePublished - May 2004


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