TY - JOUR
T1 - Chip-to-chip optoelectronics SOP on organic boards or packages
AU - Chang, Gee Kung
AU - Guidotti, Daniel
AU - Liu, Fuhan
AU - Chang, Yin Jung
AU - Huang, Zhaoran
AU - Sundaram, Venkatesh
AU - Balaraman, Devarajan
AU - Hegde, Shashikant
AU - Tummala, Rao R.
PY - 2004/5
Y1 - 2004/5
N2 - In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.
AB - In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.
UR - http://www.scopus.com/inward/record.url?scp=4544255367&partnerID=8YFLogxK
U2 - 10.1109/TADVP.2004.831880
DO - 10.1109/TADVP.2004.831880
M3 - 期刊論文
AN - SCOPUS:4544255367
SN - 1521-3323
VL - 27
SP - 386
EP - 397
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 2
ER -