Chip-Level Optical Interconnects Using Polymer Waveguide Integrated with Laser/PD on Silicon

Po Kuan Shen, Chin Ta Chen, Ruei Hung Chen, Shu Shuan Lin, Chia Chi Chang, Hsu Liang Hsiao, Hsiao Chin Lan, Yun Chih Lee, Yo Shen Lin, Mount Learn Wu

Research output: Contribution to journalArticlepeer-review

11 Scopus citations


In this letter, we demonstrate a chip-level high-speed optical interconnect, where the optical transmitter/receiver, the polymer waveguides, and the silicon-trench 45° microreflectors are integrated on a single silicon platform. The silicon platform with a silicon trench can provide independent photonic and electrical layers, respectively, for high-speed and low-speed (except high-frequency transmission lines) data transmissions. In order to demonstrate the technical capability of chip-level optical interconnects, the vertical-cavity surface-emitting laser (VCSEL)/photodetector (PD) and the driver/amplifier IC as well as the polymer waveguides combined with the 45° microreflectors are integrated on the electrical and photonic layers of the silicon platform, respectively. The total optical transmission (VCSEL-to-waveguide-to-PD via two 45° microreflectors) is-4.7 dB. The high-speed transmission experiment shows the clear eye opening up to 20-Gbit/s data rate. The bit error rate better than 10-12 for the proposed architecture is also successfully demonstrated. It reveals such chip-level optical interconnects based on the proposed silicon platform with the polymer waveguides is suitable for high-speed data transmission.

Original languageEnglish
Article number7061439
Pages (from-to)1359-1362
Number of pages4
JournalIEEE Photonics Technology Letters
Issue number13
StatePublished - 1 Jul 2015


  • micro mirrors
  • OOptical waveguides
  • optical interconnection
  • silicon substrate


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