Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin Ta Chen; Po Kuan Shen; Teng Zhang Zhu; Chia Chi Chang; Shu Shuan Lin; Mao Yuan Zeng; Chien Yu Chiu; Hsu Liang Hsiao; Hsiao Chin Lan; Yun Chih Lee; Yo Shen Lin; Mount Learn Wu

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin Ta Chen, Po Kuan Shen, Teng Zhang Zhu, Chia Chi Chang, Shu Shuan Lin, Mao Yuan Zeng, Chien Yu Chiu, Hsu Liang Hsiao, Hsiao Chin Lan, Yun Chih Lee, Yo Shen Lin, Mount Learn Wu

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The chip-level 10-Gbit/s optical interconnects with the BER better than 10^-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

Original language	English
Title of host publication	Optical Fiber Communication Conference, OFC 2014
Publisher	Optical Society of America
ISBN (Print)	9781557529930
State	Published - 2014
Event	Optical Fiber Communication Conference, OFC 2014 - San Francisco, CA, United States Duration: 9 Mar 2014 → 13 Mar 2014

Publication series

Name	Optics InfoBase Conference Papers
ISSN (Electronic)	2162-2701

Conference

Conference	Optical Fiber Communication Conference, OFC 2014
Country/Territory	United States
City	San Francisco, CA
Period	9/03/14 → 13/03/14

Cite this

Chen, C. T., Shen, P. K., Zhu, T. Z., Chang, C. C., Lin, S. S., Zeng, M. Y., Chiu, C. Y., Hsiao, H. L., Lan, H. C., Lee, Y. C., Lin, Y. S., & Wu, M. L. (2014). Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. In Optical Fiber Communication Conference, OFC 2014 (Optics InfoBase Conference Papers). Optical Society of America.

@inproceedings{2b9ae506861b469681293d47bd7636b5,

title = "Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate",

abstract = "The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.",

author = "Chen, {Chin Ta} and Shen, {Po Kuan} and Zhu, {Teng Zhang} and Chang, {Chia Chi} and Lin, {Shu Shuan} and Zeng, {Mao Yuan} and Chiu, {Chien Yu} and Hsiao, {Hsu Liang} and Lan, {Hsiao Chin} and Lee, {Yun Chih} and Lin, {Yo Shen} and Wu, {Mount Learn}",

year = "2014",

language = "???core.languages.en_GB???",

isbn = "9781557529930",

series = "Optics InfoBase Conference Papers",

publisher = "Optical Society of America",

booktitle = "Optical Fiber Communication Conference, OFC 2014",

note = "Optical Fiber Communication Conference, OFC 2014 ; Conference date: 09-03-2014 Through 13-03-2014",

}

Chen, CT, Shen, PK, Zhu, TZ, Chang, CC, Lin, SS, Zeng, MY, Chiu, CY, Hsiao, HL, Lan, HC, Lee, YC, Lin, YS & Wu, ML 2014, Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. in Optical Fiber Communication Conference, OFC 2014. Optics InfoBase Conference Papers, Optical Society of America, Optical Fiber Communication Conference, OFC 2014, San Francisco, CA, United States, 9/03/14.

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. / Chen, Chin Ta; Shen, Po Kuan; Zhu, Teng Zhang et al.
Optical Fiber Communication Conference, OFC 2014. Optical Society of America, 2014. (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

AU - Chen, Chin Ta

AU - Shen, Po Kuan

AU - Zhu, Teng Zhang

AU - Chang, Chia Chi

AU - Lin, Shu Shuan

AU - Zeng, Mao Yuan

AU - Chiu, Chien Yu

AU - Hsiao, Hsu Liang

AU - Lan, Hsiao Chin

AU - Lee, Yun Chih

AU - Lin, Yo Shen

AU - Wu, Mount Learn

PY - 2014

Y1 - 2014

N2 - The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

AB - The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=84898654279&partnerID=8YFLogxK

M3 - 會議論文篇章

AN - SCOPUS:84898654279

SN - 9781557529930

T3 - Optics InfoBase Conference Papers

BT - Optical Fiber Communication Conference, OFC 2014

PB - Optical Society of America

T2 - Optical Fiber Communication Conference, OFC 2014

Y2 - 9 March 2014 through 13 March 2014

ER -

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

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Publication series

Conference

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