Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin Ta Chen; Po Kuan Shen; Teng Zhang Zhu; Chia Chi Chang; Shu Shuan Lin; Mao Yuan Zeng; Chien Yu Chiu; Hsu Liang Hsiao; Hsiao Chin Lan; Yun Chih Lee; Yo Shen Lin; Mount Learn Wu

doi:10.1109/OFC.2014.6886567

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin Ta Chen, Po Kuan Shen, Teng Zhang Zhu, Chia Chi Chang, Shu Shuan Lin, Mao Yuan Zeng, Chien Yu Chiu, Hsu Liang Hsiao, Hsiao Chin Lan, Yun Chih Lee, Yo Shen Lin, Mount Learn Wu

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The chip-level 10-Gbit/s optical interconnects with the BER better than 10^-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

Original language	English
Title of host publication	2014 Optical Fiber Communications Conference and Exhibition, OFC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781557529930
DOIs	https://doi.org/10.1109/OFC.2014.6886567
State	Published - 2014
Event	2014 Optical Fiber Communications Conference and Exhibition, OFC 2014 - San Francisco, CA, United States Duration: 9 Mar 2014 → 13 Mar 2014

Publication series

Name	Conference on Optical Fiber Communication, Technical Digest Series

Conference

Conference	2014 Optical Fiber Communications Conference and Exhibition, OFC 2014
Country/Territory	United States
City	San Francisco, CA
Period	9/03/14 → 13/03/14

Access to Document

10.1109/OFC.2014.6886567

Cite this

Chen, C. T., Shen, P. K., Zhu, T. Z., Chang, C. C., Lin, S. S., Zeng, M. Y., Chiu, C. Y., Hsiao, H. L., Lan, H. C., Lee, Y. C., Lin, Y. S., & Wu, M. L. (2014). Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. In 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014 Article 6886567 (Conference on Optical Fiber Communication, Technical Digest Series). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OFC.2014.6886567

@inproceedings{495fac40ebf84a05880ea8ac9904be66,

title = "Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate",

abstract = "The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.",

author = "Chen, {Chin Ta} and Shen, {Po Kuan} and Zhu, {Teng Zhang} and Chang, {Chia Chi} and Lin, {Shu Shuan} and Zeng, {Mao Yuan} and Chiu, {Chien Yu} and Hsiao, {Hsu Liang} and Lan, {Hsiao Chin} and Lee, {Yun Chih} and Lin, {Yo Shen} and Wu, {Mount Learn}",

year = "2014",

doi = "10.1109/OFC.2014.6886567",

language = "???core.languages.en_GB???",

isbn = "9781557529930",

series = "Conference on Optical Fiber Communication, Technical Digest Series",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2014 Optical Fiber Communications Conference and Exhibition, OFC 2014",

note = "2014 Optical Fiber Communications Conference and Exhibition, OFC 2014 ; Conference date: 09-03-2014 Through 13-03-2014",

}

Chen, CT, Shen, PK, Zhu, TZ, Chang, CC, Lin, SS, Zeng, MY, Chiu, CY, Hsiao, HL, Lan, HC, Lee, YC, Lin, YS & Wu, ML 2014, Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. in 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014., 6886567, Conference on Optical Fiber Communication, Technical Digest Series, Institute of Electrical and Electronics Engineers Inc., 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014, San Francisco, CA, United States, 9/03/14. https://doi.org/10.1109/OFC.2014.6886567

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. / Chen, Chin Ta; Shen, Po Kuan; Zhu, Teng Zhang et al.
2014 Optical Fiber Communications Conference and Exhibition, OFC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 6886567 (Conference on Optical Fiber Communication, Technical Digest Series).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

AU - Chen, Chin Ta

AU - Shen, Po Kuan

AU - Zhu, Teng Zhang

AU - Chang, Chia Chi

AU - Lin, Shu Shuan

AU - Zeng, Mao Yuan

AU - Chiu, Chien Yu

AU - Hsiao, Hsu Liang

AU - Lan, Hsiao Chin

AU - Lee, Yun Chih

AU - Lin, Yo Shen

AU - Wu, Mount Learn

PY - 2014

Y1 - 2014

N2 - The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

AB - The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=84907416580&partnerID=8YFLogxK

U2 - 10.1109/OFC.2014.6886567

DO - 10.1109/OFC.2014.6886567

M3 - 會議論文篇章

AN - SCOPUS:84907416580

SN - 9781557529930

T3 - Conference on Optical Fiber Communication, Technical Digest Series

BT - 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014

Y2 - 9 March 2014 through 13 March 2014

ER -

Chen CT, Shen PK, Zhu TZ, Chang CC, Lin SS, Zeng MY et al. Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. In 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 6886567. (Conference on Optical Fiber Communication, Technical Digest Series). doi: 10.1109/OFC.2014.6886567

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Abstract

Publication series

Conference

Access to Document

Fingerprint

Cite this