Chip-level 1 2 optical interconnects using polymer vertical splitter on silicon substrate

Chin Ta Chen, Po Kuan Shen, Teng Zhang Zhu, Chia Chi Chang, Shu Shuan Lin, Mao Yuan Zeng, Chien Yu Chiu, Hsu Liang Hsiao, Hsiao Chin Lan, Yun Chih Lee, Yo Shen Lin, Mount Learn Wu

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The chip-level 12 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 12 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45̂ reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of-3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10 -12 for two output ports is achieved. It reveals that such chip-level 12 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.

Original languageEnglish
Article number6746668
JournalIEEE Photonics Journal
Volume6
Issue number2
DOIs
StatePublished - 1 Apr 2014

Keywords

  • micromirrors
  • optical interconnection
  • Optical waveguides
  • silicon substrate

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