Bonding of thermoplastic microfluidic device by water assistance

Chia Wen Tsao; Chang Yen Chang; Wei Wen Hu; Yun Shan Tian

doi:10.1016/j.ijadhadh.2023.103429

Bonding of thermoplastic microfluidic device by water assistance

Chia Wen Tsao, Chang Yen Chang, Wei Wen Hu, Yun Shan Tian

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

We present a water-assisted microwave bonding (H₂O-μWave bonding) process for sealing thermoplastic microfluidic devices. We use water as the bonding reagent to assist the formation of covalent bonds after surface activation and water evaporation procedures. In surface activation step, we exam UV/Ozone and O₂ plasma surface treatments and their effects of the surface wettability, optical transmissivity, surface morphology, and surface chemistry on a polymethyl methacrylate (PMMA) substrate in H₂O-μWave bonding. After surface activation, water evaporation step was performed to form the bonds. The bonding can be simply formed by leaving the surface-activated pair in the room environment after water application. We examined the bonding strength and coverage of PMMA by both room temperature drying and microwave annealing approaches in H₂O-μWave bonding. Finally, stability and multilayer bonding were also tested to evaluate the quality of H₂O-μWave bonding.

Original language	English
Article number	103429
Journal	International Journal of Adhesion and Adhesives
Volume	125
DOIs	https://doi.org/10.1016/j.ijadhadh.2023.103429
State	Published - Jul 2023

Keywords

Interfacial heating
Microwave bonding
Multilayer bonding
Water-assisted bonding

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10.1016/j.ijadhadh.2023.103429

利用微液滴沉積法以及微液滴透鏡進行表面增強拉曼散射檢測之研究(1/3)
Tsao, C.-W. (PI)
1/08/22 → 31/07/23
Project: Research

Cite this

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title = "Bonding of thermoplastic microfluidic device by water assistance",

abstract = "We present a water-assisted microwave bonding (H2O-μWave bonding) process for sealing thermoplastic microfluidic devices. We use water as the bonding reagent to assist the formation of covalent bonds after surface activation and water evaporation procedures. In surface activation step, we exam UV/Ozone and O2 plasma surface treatments and their effects of the surface wettability, optical transmissivity, surface morphology, and surface chemistry on a polymethyl methacrylate (PMMA) substrate in H2O-μWave bonding. After surface activation, water evaporation step was performed to form the bonds. The bonding can be simply formed by leaving the surface-activated pair in the room environment after water application. We examined the bonding strength and coverage of PMMA by both room temperature drying and microwave annealing approaches in H2O-μWave bonding. Finally, stability and multilayer bonding were also tested to evaluate the quality of H2O-μWave bonding.",

keywords = "Interfacial heating, Microwave bonding, Multilayer bonding, Water-assisted bonding",

author = "Tsao, {Chia Wen} and Chang, {Chang Yen} and Hu, {Wei Wen} and Tian, {Yun Shan}",

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T1 - Bonding of thermoplastic microfluidic device by water assistance

AU - Tsao, Chia Wen

AU - Chang, Chang Yen

AU - Hu, Wei Wen

AU - Tian, Yun Shan

PY - 2023/7

Y1 - 2023/7

N2 - We present a water-assisted microwave bonding (H2O-μWave bonding) process for sealing thermoplastic microfluidic devices. We use water as the bonding reagent to assist the formation of covalent bonds after surface activation and water evaporation procedures. In surface activation step, we exam UV/Ozone and O2 plasma surface treatments and their effects of the surface wettability, optical transmissivity, surface morphology, and surface chemistry on a polymethyl methacrylate (PMMA) substrate in H2O-μWave bonding. After surface activation, water evaporation step was performed to form the bonds. The bonding can be simply formed by leaving the surface-activated pair in the room environment after water application. We examined the bonding strength and coverage of PMMA by both room temperature drying and microwave annealing approaches in H2O-μWave bonding. Finally, stability and multilayer bonding were also tested to evaluate the quality of H2O-μWave bonding.

AB - We present a water-assisted microwave bonding (H2O-μWave bonding) process for sealing thermoplastic microfluidic devices. We use water as the bonding reagent to assist the formation of covalent bonds after surface activation and water evaporation procedures. In surface activation step, we exam UV/Ozone and O2 plasma surface treatments and their effects of the surface wettability, optical transmissivity, surface morphology, and surface chemistry on a polymethyl methacrylate (PMMA) substrate in H2O-μWave bonding. After surface activation, water evaporation step was performed to form the bonds. The bonding can be simply formed by leaving the surface-activated pair in the room environment after water application. We examined the bonding strength and coverage of PMMA by both room temperature drying and microwave annealing approaches in H2O-μWave bonding. Finally, stability and multilayer bonding were also tested to evaluate the quality of H2O-μWave bonding.

KW - Interfacial heating

KW - Microwave bonding

KW - Multilayer bonding

KW - Water-assisted bonding

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U2 - 10.1016/j.ijadhadh.2023.103429

DO - 10.1016/j.ijadhadh.2023.103429

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SN - 0143-7496

VL - 125

JO - International Journal of Adhesion and Adhesives

JF - International Journal of Adhesion and Adhesives

M1 - 103429

ER -

Bonding of thermoplastic microfluidic device by water assistance

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Keywords

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利用微液滴沉積法以及微液滴透鏡進行表面增強拉曼散射檢測之研究(1/3)

Cite this