Barrier property of a Ta/MnSixOy Layer formed by a ta-mn alloy for a cu interconnect

Cheng Lun Hsin, Kun Yen Lin

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

The advanced back-end module of very-large-scale-integrated-circuits (VLSIs) requires an ultrathin diffusion barrier layer between the Cu interconnect and low-K oxides. In this letter, we investigated the electrical properties of the barrier layer formed by a Ta-Mn alloy. A diffusion barrier layer self-formed at the interface during annealing, and the .Ta/MnSi bilayer structures were investigated by standard microscopy. Black's equation and the measured mean-time-to-failure (MTTF) were used to obtain the reliability characteristics under different temperatures and current densities. The reliability is approximately two times better than that of the conventional TaN/Ta counterpart. The confidence intervals at 95% for each MTTF confirmed the single failure mode, and the electromigration phenomenon was observed to be the failure mechanism. Our results provide evidence that is a promising barrier material for Cu interconnects in VLSIs.

Original languageEnglish
Article number7494920
Pages (from-to)1048-1050
Number of pages3
JournalIEEE Electron Device Letters
Volume37
Issue number8
DOIs
StatePublished - Aug 2016

Keywords

  • Cu interconnect
  • TaMn
  • diffusion barrier
  • reliability

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