Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

S. J. Wang, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

45 Scopus citations

Abstract

Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.

Original languageEnglish
Pages (from-to)347-350
Number of pages4
JournalScripta Materialia
Volume55
Issue number4
DOIs
StatePublished - Aug 2006

Keywords

  • Packaging
  • Solder

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