An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Yu Chieh Huang, Po Tsang Huang, Shang Lin Wu, Yu Chen Hu, Yan Huei You, Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Kuan Neng Chen, Ching Te Chuang, Jin Chern Chiou

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

Original languageEnglish
Title of host publicationISCAS 2016 - IEEE International Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1302-1305
Number of pages4
ISBN (Electronic)9781479953400
DOIs
StatePublished - 29 Jul 2016
Event2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada
Duration: 22 May 201625 May 2016

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2016-July
ISSN (Print)0271-4310

Conference

Conference2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
Country/TerritoryCanada
CityMontreal
Period22/05/1625/05/16

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