An infrastructure IP for repairing multiple RAMs in SOCs

Chao Da Huang, Tsu Wei Tseng, Jin Fu Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

Modem complex system-on-chips (SOCs) need infrastructure IPs to test, diagnosis, and repair embedded memories. This paper presents an infrastructure IP (IIP) for repairing multiple RAMs in SOCs. The proposed IIP can perform parallel test for multiple memories, and serial diagnosis or repair for one memory each time. Especially, the proposed IIP can execute various redundancy analysis algorithms. We realize the proposed IIP for four memories based on TSMC 0.18μm standard cell technology. Experimental results show that the area overhead of the IIP is only about 4.6%.

Original languageEnglish
Title of host publication2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers
Pages163-166
Number of pages4
DOIs
StatePublished - 2007
Event2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Hsinchu, Taiwan
Duration: 26 Apr 200728 Apr 2007

Publication series

Name2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers

Conference

Conference2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006
Country/TerritoryTaiwan
CityHsinchu
Period26/04/0728/04/07

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