An in-situ performance test of liquid cooling for a server computer system

Chien Yuh Yang; Chun Ta Yeh; Pei Kang Wang; Wei Chi Liu; Edward Yu Chun Kung

doi:10.1109/IMPACT.2010.5699666

An in-situ performance test of liquid cooling for a server computer system

Chien Yuh Yang, Chun Ta Yeh, Pei Kang Wang, Wei Chi Liu, Edward Yu Chun Kung

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

An IBM power series server x3350 was tested by using the liquid cooling system developed by Yang et al. [3, 4, 5]. The performance of the heat pipe based direct air cooling system equipped in the original server was also tested for comparison. Both CPU core temperature and cooling system noise level were measured in the present test. he test results of liquid cooling and direct air cooling show that the maximum average core temperature to air temperature difference (at 100% CPU loading condition) is 46.5°C for IBM original direct air cooling but only 24.8°C for liquid cooling at heat sink fan speed of 2200 rpm. At which the noise level is 59.5 and 49.5 dB respectively. While reduced the heat sink fan speed of the liquid cooling system to 1080 rpm, the core to air temperature difference slightly increased to 28.4°C, but the noise level reduced to 36.5 dB. The liquid cooling system required only 1/5 to 1/3.5 of power of the direct air cooling did. These results indicated that the liquid cooling system provides much higher cooling performance but lower noise and lower power consumption than the direct air cooling system for high power server.

Original language	English
Title of host publication	International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs	https://doi.org/10.1109/IMPACT.2010.5699666
State	Published - 2010
Event	2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan Duration: 20 Oct 2010 → 22 Oct 2010

Publication series

Name	International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Conference

Conference	2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Country/Territory	Taiwan
City	Taipei
Period	20/10/10 → 22/10/10

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10.1109/IMPACT.2010.5699666

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Yang, C. Y., Yeh, C. T., Wang, P. K., Liu, W. C., & Kung, E. Y. C. (2010). An in-situ performance test of liquid cooling for a server computer system. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings Article 5699666 (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699666

Yang, Chien Yuh ; Yeh, Chun Ta ; Wang, Pei Kang et al. / An in-situ performance test of liquid cooling for a server computer system. International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

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title = "An in-situ performance test of liquid cooling for a server computer system",

abstract = "An IBM power series server x3350 was tested by using the liquid cooling system developed by Yang et al. [3, 4, 5]. The performance of the heat pipe based direct air cooling system equipped in the original server was also tested for comparison. Both CPU core temperature and cooling system noise level were measured in the present test. he test results of liquid cooling and direct air cooling show that the maximum average core temperature to air temperature difference (at 100% CPU loading condition) is 46.5°C for IBM original direct air cooling but only 24.8°C for liquid cooling at heat sink fan speed of 2200 rpm. At which the noise level is 59.5 and 49.5 dB respectively. While reduced the heat sink fan speed of the liquid cooling system to 1080 rpm, the core to air temperature difference slightly increased to 28.4°C, but the noise level reduced to 36.5 dB. The liquid cooling system required only 1/5 to 1/3.5 of power of the direct air cooling did. These results indicated that the liquid cooling system provides much higher cooling performance but lower noise and lower power consumption than the direct air cooling system for high power server.",

author = "Yang, {Chien Yuh} and Yeh, {Chun Ta} and Wang, {Pei Kang} and Liu, {Wei Chi} and Kung, {Edward Yu Chun}",

year = "2010",

doi = "10.1109/IMPACT.2010.5699666",

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isbn = "9781424497836",

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booktitle = "International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings",

note = "2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference ; Conference date: 20-10-2010 Through 22-10-2010",

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Yang, CY, Yeh, CT, Wang, PK, Liu, WC & Kung, EYC 2010, An in-situ performance test of liquid cooling for a server computer system. in International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings., 5699666, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Taipei, Taiwan, 20/10/10. https://doi.org/10.1109/IMPACT.2010.5699666

An in-situ performance test of liquid cooling for a server computer system. / Yang, Chien Yuh; Yeh, Chun Ta; Wang, Pei Kang et al.
International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699666 (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - An in-situ performance test of liquid cooling for a server computer system

AU - Yang, Chien Yuh

AU - Yeh, Chun Ta

AU - Wang, Pei Kang

AU - Liu, Wei Chi

AU - Kung, Edward Yu Chun

PY - 2010

Y1 - 2010

N2 - An IBM power series server x3350 was tested by using the liquid cooling system developed by Yang et al. [3, 4, 5]. The performance of the heat pipe based direct air cooling system equipped in the original server was also tested for comparison. Both CPU core temperature and cooling system noise level were measured in the present test. he test results of liquid cooling and direct air cooling show that the maximum average core temperature to air temperature difference (at 100% CPU loading condition) is 46.5°C for IBM original direct air cooling but only 24.8°C for liquid cooling at heat sink fan speed of 2200 rpm. At which the noise level is 59.5 and 49.5 dB respectively. While reduced the heat sink fan speed of the liquid cooling system to 1080 rpm, the core to air temperature difference slightly increased to 28.4°C, but the noise level reduced to 36.5 dB. The liquid cooling system required only 1/5 to 1/3.5 of power of the direct air cooling did. These results indicated that the liquid cooling system provides much higher cooling performance but lower noise and lower power consumption than the direct air cooling system for high power server.

AB - An IBM power series server x3350 was tested by using the liquid cooling system developed by Yang et al. [3, 4, 5]. The performance of the heat pipe based direct air cooling system equipped in the original server was also tested for comparison. Both CPU core temperature and cooling system noise level were measured in the present test. he test results of liquid cooling and direct air cooling show that the maximum average core temperature to air temperature difference (at 100% CPU loading condition) is 46.5°C for IBM original direct air cooling but only 24.8°C for liquid cooling at heat sink fan speed of 2200 rpm. At which the noise level is 59.5 and 49.5 dB respectively. While reduced the heat sink fan speed of the liquid cooling system to 1080 rpm, the core to air temperature difference slightly increased to 28.4°C, but the noise level reduced to 36.5 dB. The liquid cooling system required only 1/5 to 1/3.5 of power of the direct air cooling did. These results indicated that the liquid cooling system provides much higher cooling performance but lower noise and lower power consumption than the direct air cooling system for high power server.

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SN - 9781424497836

T3 - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference

Y2 - 20 October 2010 through 22 October 2010

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Yang CY, Yeh CT, Wang PK, Liu WC, Kung EYC. An in-situ performance test of liquid cooling for a server computer system. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699666. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). doi: 10.1109/IMPACT.2010.5699666

An in-situ performance test of liquid cooling for a server computer system

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