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An atmospheric-pressure plasma process for C
2
F
6
removal
Moo Been Chang
, Sheng Jen Yu
Center for Environmental Monitoring and Technology
Department of Civil Engineering
Graduate Institute of Environmental Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
53
Scopus citations
Overview
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Dive into the research topics of 'An atmospheric-pressure plasma process for C
2
F
6
removal'. Together they form a unique fingerprint.
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Engineering
Experimental Result
100%
Dielectrics
100%
Plasma Process
100%
Pressure Plasma
100%
Atmospheric Pressure
100%
Removal Efficiency
66%
Chemical Vapor Deposition
33%
Vapor Deposition
33%
Applied Voltage
33%
Gas Streams
33%
Infrared Radiation
33%
Plasma Applications
33%
Keyphrases
Plasma Process
100%
C2F6
100%
Atmospheric Pressure Plasma
100%
Dielectric Barrier Discharge
42%
Removal Efficiency
28%
Plasma Catalysis
28%
Perfluoro Compounds
28%
Chemical Vapor Deposition
14%
Applied Voltage
14%
COF2
14%
Innovative Approach
14%
Plasma Generation
14%
Gas Stream
14%
Semiconductor Industry
14%
Discharge Process
14%
Plasma Etching
14%
Infrared Radiation
14%
Greenhouse Effect
14%
Inert Gas
14%
Plasma Chemical
14%
Atmospheric Pressure Plasma Processing
14%
Physics
Dielectric Barrier Discharge
100%
Plasma Process
100%
Atmospheric Pressure
100%
Carbon Dioxide
33%
Vapor Deposition
33%
Plasma Generator
33%
Gas Streams
33%
Plasma Etching
33%
Greenhouse Effect
33%
Infrared Radiation
33%
Rare Gas
33%
Material Science
Dielectric Material
100%
Catalysis
66%
Carbon Dioxide
33%
Chemical Vapor Deposition
33%
Plasma Etching
33%
Inert Gas
33%
Chemical Engineering
Plasma Process
100%
Vapor Deposition
50%
Chemical Vapor Deposition
50%