An anchor-board-based flexible optoelectronic harness for off-chip optical interconnects

Yin Jung Chang; Daniel Guidotti; Gee Kung Chang

doi:10.1109/LPT.2008.921822

An anchor-board-based flexible optoelectronic harness for off-chip optical interconnects

Yin Jung Chang, Daniel Guidotti, Gee Kung Chang

Department of Optics and Photonics

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

A flexible optical interconnect prototype at board/card-level using a novel anchor-board-based optoelectronic (OE) harness is experimentally demonstrated at 2 Gb/s. The flexible OE harness comprises a thin polyimide film laminated on two narrow anchor boards where edge-emitting lasers (EELs) and p-i-n photodetectors (PDs) are positioned and integrated with polymer waveguides. High-speed electronics are surface-mounted on two separate printed-circuit boards, making the OE harness detachable and field-reparable. A large EEL-PD lateral alignment tolerance of >1.5 mm for a 15-cm interconnect distance is achieved without any microlens. One or multiple channels can be simultaneously aligned and formed during one single ultraviolet exposure. A cost-effective field repair strategy is thus envisioned.

Original language	English
Pages (from-to)	839-841
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	20
Issue number	10
DOIs	https://doi.org/10.1109/LPT.2008.921822
State	Published - 15 May 2008

Keywords

Flexible substrate
Optical interconnections

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10.1109/LPT.2008.921822

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abstract = "A flexible optical interconnect prototype at board/card-level using a novel anchor-board-based optoelectronic (OE) harness is experimentally demonstrated at 2 Gb/s. The flexible OE harness comprises a thin polyimide film laminated on two narrow anchor boards where edge-emitting lasers (EELs) and p-i-n photodetectors (PDs) are positioned and integrated with polymer waveguides. High-speed electronics are surface-mounted on two separate printed-circuit boards, making the OE harness detachable and field-reparable. A large EEL-PD lateral alignment tolerance of >1.5 mm for a 15-cm interconnect distance is achieved without any microlens. One or multiple channels can be simultaneously aligned and formed during one single ultraviolet exposure. A cost-effective field repair strategy is thus envisioned.",

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AU - Guidotti, Daniel

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AB - A flexible optical interconnect prototype at board/card-level using a novel anchor-board-based optoelectronic (OE) harness is experimentally demonstrated at 2 Gb/s. The flexible OE harness comprises a thin polyimide film laminated on two narrow anchor boards where edge-emitting lasers (EELs) and p-i-n photodetectors (PDs) are positioned and integrated with polymer waveguides. High-speed electronics are surface-mounted on two separate printed-circuit boards, making the OE harness detachable and field-reparable. A large EEL-PD lateral alignment tolerance of >1.5 mm for a 15-cm interconnect distance is achieved without any microlens. One or multiple channels can be simultaneously aligned and formed during one single ultraviolet exposure. A cost-effective field repair strategy is thus envisioned.

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An anchor-board-based flexible optoelectronic harness for off-chip optical interconnects

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Keywords

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